ZutaCore Raises $100M to Scale Waterless Cooling

According to ZutaCore's company press release and contemporaneous reporting by StorageReview, DataCenterDynamics, SiliconANGLE, and HPCwire, ZutaCore raised $100 million in a Series C financing with strategic participation from Mitsubishi Electric, Carrier Ventures, and Samsung Electronics via Samsung Ventures. The company framed the round as support for global commercialization, increased deployments, research and development, and expansion of its executive team, per the press release and media coverage. DataCenterDynamics reports that Goldman Sachs acted as placement agent for the raise.

ZutaCore's product family is described in the press materials and trade reporting as a waterless, direct-to-chip, two-phase cooling platform that uses a sealed, closed-loop dielectric fluid to boil at the chip-level and then condense in a coolant distribution unit. SiliconANGLE identifies the platform trade name as HyperCool and notes a recently introduced OmniTherm cold plate that targets Nvidia RTX PRO 6000 Blackwell Server Edition in a single-slot PCIe form. Multiple outlets report that the technology is designed to support processors drawing greater than 4,000 watts, and the company states it has achieved more than 75 deployments across the Americas, Europe, and Asia.

Analysts and trade outlets have documented accelerating adoption of liquid cooling in hyperscale and enterprise data centers as rack and node power densities climb. Public reporting framed ZutaCore's financing as part of a broader move toward high-performance, low-water-consumption cooling solutions, with SiliconANGLE emphasizing the waterless attribute as an operational and regulatory differentiator in water-constrained regions. StorageReview and DataCenterDynamics place the raise alongside growing demand for megawatt-class AI and HPC deployments that require thermals beyond conventional air cooling.

Erez Freibach, chairman and CEO of ZutaCore, is quoted in DataCenterDynamics saying, "$100m of funding reflects strong validation from leading global partners and growing demand for our technology." The press release and trade coverage also describe the company adding four senior executives, including Yaniv Reinhold as CFO, Sharon Shafran as COO, and other leadership hires to support international expansion, per the company announcement.

Observers should watch for three measurable indicators: deployment scale and customer references in multimegawatt AI clusters; interoperability evidence with major server OEMs and chip vendors beyond current integrations; and demonstration of long-term reliability and maintenance workflows for sealed two-phase systems in production environments. ZutaCore and coverage by trade outlets note ongoing R&D aimed at in-package thermal management and system-level integration for megawatt-class sites, per the press materials.

For practitioners: If two-phase, waterless cooling achieves the reliability and retrofit compatibility reported by ZutaCore and covered in trade press, operators could have an additional pathway to reach higher rack densities with lower water usage. Adoption will depend on integration effort, lifecycle serviceability, and supply-chain availability for cold plates and coolant distribution units. The company cited R&D and scaling to support deployments in its announcement.

The rationale statements about how funds will be allocated and the company's deployment metrics come from ZutaCore's press release and corroborating trade reporting. The company has not published independent third-party audits of performance or field reliability in the materials cited here.