ZutaCore Raises $100M to Scale Waterless Cooling

ZutaCore announced a $100 million Series C on June 2, 2026, with strategic participation from Mitsubishi Electric, Carrier Ventures, and Samsung Electronics via Samsung Ventures, per the company press release and reporting by StorageReview, DataCenterDynamics, SiliconANGLE, and HPCwire. DataCenterDynamics reports Goldman Sachs acted as exclusive placement agent, and CTech reports the round values the company at roughly $600 million and lifts total funding since founding to about $200 million. The company framed the raise as support for global commercialization, expanded deployments, R&D, and an enlarged executive team.

Trade reporting describes ZutaCore's platform as a waterless, direct-to-chip, two-phase system that uses a sealed, closed-loop dielectric fluid that boils at the chip and condenses in a coolant distribution unit. SiliconANGLE identifies the platform trade name as HyperCool and notes a recently introduced OmniTherm cold plate targeting Nvidia's RTX PRO 6000 Blackwell Server Edition in a single-slot PCIe form. Multiple outlets report the technology is designed for processors drawing more than 4,000 watts, and the company states it has reached more than 75 deployments across the Americas, Europe, and Asia.

Trade outlets have documented accelerating adoption of liquid cooling as rack and node power densities climb with AI and HPC build-outs. Coverage frames ZutaCore's financing as part of a broader shift toward high-density, low-water cooling, with SiliconANGLE emphasizing the waterless attribute as an operational and regulatory differentiator in water-constrained regions.

Erez Freibach, chairman and CEO of ZutaCore, is quoted in DataCenterDynamics saying, "$100m of funding reflects strong validation from leading global partners and growing demand for our technology." The company and trade coverage also describe several senior hires, including Yaniv Reinhold as CFO and Sharon Shafran as COO, to support international expansion.

Three measurable indicators matter most: deployment scale and customer references in multi-megawatt AI clusters; interoperability evidence with major server OEMs and chip vendors beyond current integrations; and demonstrated long-term reliability and maintenance workflows for sealed two-phase systems in production.

For practitioners: If waterless two-phase cooling achieves the reliability and retrofit compatibility the company reports, operators could gain another path to higher rack densities with lower water use; adoption will hinge on integration effort, lifecycle serviceability, and supply of cold plates and coolant distribution units. Note that deployment metrics and fund-allocation plans come from ZutaCore and corroborating trade press; independent third-party audits of field performance are not published in the materials cited here.