SolidRun introduced the Bedrock RAI300, a fanless industrial PC built around AMD’s Ryzen AI 9 HX 370 processor and its Zen 5 architecture. The system pairs 12 CPU cores, an RDNA 3.5 GPU and an XDNA 2 NPU delivering up to 50 TOPS, supports up to 128 GB DDR5 and modular I/O with optional Hailo accelerators. SolidRun offers a 10-year availability commitment for long-lifecycle deployments.
Key Points
- 1Includes AMD Ryzen AI 9 HX 370 with 12 Zen 5 cores, RDNA 3.5 GPU, XDNA 2 NPU (50 TOPS)
- 2Enables edge AI workloads via unified memory up to 128 GB DDR5 and optional Hailo accelerator modules
- 3Supports industrial deployment with fanless liquid-metal cooling, modular I/O, wide DC input and 10-year availability
Scoring Rationale
High practical value for industrial edge deployments; limited technical novelty beyond AMD silicon integration and packaging.
Sources
Public references used for this report.
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