Nvidia CEO Meets SK Group Chairman to Discuss AI Memory Cooperation

Jensen Huang, CEO of Nvidia, met SK Group Chairman Chey Tae-won in Taipei on June 1, according to a post on SK Group's account cited by Yonhap. The post, as reported by Yonhap, said the executives met on the sidelines of Computex to mark SK hynix reaching a market capitalization of 1 trillion dollars and to discuss future cooperation in AI memory. Yonhap reports Huang visited SK hynix's Computex booth to review next-generation high-bandwidth memory samples and left handwritten notes on wafers, writing "Please make more" on an HBM4E sample and "Love SOCAMM" on a SOCAMM module.

Per Yonhap, SK hynix supplies HBM4 to Nvidia, and Yonhap reports Huang confirmed Nvidia has begun mass production of the Vera Rubin AI computing platform, which is equipped with HBM4. The Korea Herald and Asia Business Daily report SK hynix supplies a majority of the HBM4 destined for Vera Rubin, while The Next Web notes the stock's run to a 1 trillion dollar valuation has been powered largely by Nvidia HBM4 orders. Industry pattern: high-bandwidth memory like HBM4 is a concentrated critical input for large GPU systems, combining high throughput with lower power per bit, which materially affects data-center throughput and model scaling.

builders of large AI accelerators have increasingly limited vendor options for next-generation HBM, creating tight relationships between GPU designers and memory makers. The Korea Herald reports Chey outlined plans to roughly double SK hynix wafer capacity over five years, signaling expectations of sustained AI memory demand. Executive-level coordination at trade shows is a common mechanism to align product timing, validate samples, and showcase marquee partnerships to investors and customers.

Yonhap, citing industry sources, reports Huang planned a trip to Seoul later in the week with meetings expected with major South Korean conglomerate leaders, including LG Group Chairman Koo Kwang-mo and Naver founder Lee Hae-jin, with possible participation by Hyundai Motor Group Executive Chair Euisun Chung, plus a closed-door meeting with local robotics and AI startups and a meeting with NC Corp CEO Kim Taek-jin.

• •Announcements from SK hynix or Nvidia on HBM4 supply agreements, capacity expansions, or qualification milestones.
• •Capacity and pricing signals in the memory market, especially for HBM4 and advanced module supply.
• •Productization timelines for systems using Vera Rubin, since ship schedules drive near-term HBM demand.

For engineers and infrastructure planners, supplier-level alignments like this tend to affect procurement lead times and benchmarking expectations for new hardware generations, shaping deployment timelines and cost assumptions.