Grinn Releases ReneSOM-V2H Small Renesas-Based SoM

On Mar 3, 2026, Polish embedded-systems firm Grinn introduced the ReneSOM-V2H, a 37 × 42.6 mm system-on-module based on Renesas' RZ/V2H processor for edge AI and vision systems. The module packs heterogeneous compute (four Cortex-A55, two Cortex-R8, one Cortex-M33), a DRP-AI3 accelerator up to 8 TOPS, four MIPI-CSI, PCIe Gen3 x4, USB 3.2, LPDDR4, eMMC and industrial −40°C to 85°C operation.
Key Points
- 1Introduces 37×42.6 mm SoM integrating Renesas RZ/V2H with DRP-AI3 accelerator delivering up to 8 TOPS.
- 2Provides heterogeneous compute (Cortex-A55, Cortex-R8, Cortex-M33) for mixed real-time and application workloads.
- 3Enables compact edge-vision systems with multi-camera MIPI-CSI, PCIe Gen3, USB 3.2, and industrial temperature range.
Scoring Rationale
Strong practical impact from an official, usable edge-AI module announcement, limited novelty and missing pricing/details.
Sources
Public references used for this report.
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