Chinese Memory Makers Expand DRAM And HBM Capacity

Two leading Chinese memory chipmakers, CXMT and YMTC, are launching major production expansions to address a global supply crunch, Nikkei Asia reports. CXMT plans Shanghai DRAM and HBM capacity growth with equipment installs in H2 2026 and production in 2027, while YMTC will add DRAM capacity and HBM partnerships at a new Wuhan plant targeting 2027 output. The moves aim to serve surging local AI and server demand.
Key Points
- 1Expand production: CXMT will double-to-triple Shanghai DRAM capacity, install equipment in H2 2026, produce in 2027.
- 2Increase competitiveness: YMTC adds DRAM capacity and HBM partnerships to exploit AI-driven memory supercycle.
- 3Signal: China's localized supply reduces reliance on western vendors, broadening memory sourcing for device makers.
Scoring Rationale
Strong industry relevance and actionable expansion plans, limited by reliance on anonymous sources and lack of official confirmations.
Sources
Public references used for this report.
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