Chinese Memory Makers Expand DRAM And HBM Capacity

Two leading Chinese memory chipmakers, CXMT and YMTC, are launching major production expansions to address a global supply crunch, Nikkei Asia reports. CXMT plans Shanghai DRAM and HBM capacity growth with equipment installs in H2 2026 and production in 2027, while YMTC will add DRAM capacity and HBM partnerships at a new Wuhan plant targeting 2027 output. The moves aim to serve surging local AI and server demand.