1:"$Sreact.fragment"
d:I[57150,[],""]
:HL["/_next/static/media/26d0ba92e140f0dc-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/49eec060ce8bd0da-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/4b9bb515ce6d026f-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/558ca1a6aa3cb55e-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/5611c55482296524-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/93f479601ee12b01-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/e4af272ccee01ff0-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/media/fa3e259cafa8f47e-s.p.woff2","font",{"crossOrigin":"","type":"font/woff2"}]
:HL["/_next/static/css/ace6d38470ae6967.css?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","style"]
:HL["/_next/static/css/35e95ca1b12a32ae.css?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","style"]
2:T879,
              window.dataLayer = window.dataLayer || [];
              function gtag(){dataLayer.push(arguments);}
              var ldsStoredConsent = 'unset';
              try {
                var rawConsent = window.localStorage && window.localStorage.getItem('lds_consent_v2');
                if (rawConsent) {
                  var parsedConsent = JSON.parse(rawConsent);
                  if (parsedConsent && parsedConsent.version === 2 && parsedConsent.choice === 'all') {
                    ldsStoredConsent = 'all';
                  } else if (parsedConsent && parsedConsent.version === 2 && parsedConsent.choice === 'analytics') {
                    ldsStoredConsent = 'analytics';
                  } else if (parsedConsent && parsedConsent.version === 2 && parsedConsent.choice === 'essential') {
                    ldsStoredConsent = 'essential';
                  }
                }
              } catch (e) {}
              var ldsGpc = false;
              try {
                ldsGpc = typeof navigator !== 'undefined' && navigator.globalPrivacyControl === true;
              } catch (e) {}
              var ldsAnalyticsStorage = (ldsStoredConsent === 'all' || ldsStoredConsent === 'analytics') ? 'granted' : 'denied';
              var ldsAdStorage = ldsStoredConsent === 'all' && !ldsGpc ? 'granted' : 'denied';
              gtag('consent', 'default', {
                'analytics_storage': ldsAnalyticsStorage,
                'ad_storage': ldsAdStorage,
                'ad_user_data': ldsAdStorage,
                'ad_personalization': ldsAdStorage,
                'functionality_storage': 'granted',
                'security_storage': 'granted',
                'wait_for_update': 500
              });
              gtag('set', 'ads_data_redaction', true);
              gtag('set', 'url_passthrough', true);
              try {
                if (ldsGpc) {
                  gtag('consent', 'update', {
                    'ad_storage': 'denied',
                    'ad_user_data': 'denied',
                    'ad_personalization': 'denied'
                  });
                }
              } catch (e) {}
            3:T989,{"@context":"https://schema.org","@type":["Organization","NewsMediaOrganization","EducationalOrganization"],"@id":"https://letsdatascience.com#organization","name":"Let's Data Science","url":"https://letsdatascience.com","logo":{"@type":"ImageObject","url":"https://letsdatascience.com/lds_logo.webp","width":1024,"height":1024},"publishingPrinciples":"https://letsdatascience.com/editorial-standards","description":"Interactive data science learning platform with 1,625 SQL and Python coding problems across 15 industry domains. LDS Mentor is a built-in AI with two modes: Learn Mode uses the Socratic method to guide you to the answer, Interview Mode gives direct patterns, code skeletons, and strategies for fast interview prep. Includes free interactive courses, 496 interview recall cards, and AI-curated news. All code execution runs in-browser.","sameAs":["https://www.youtube.com/@letsdatascience","https://twitter.com/letsdatascience","https://linkedin.com/company/letsdatascience","https://github.com/letsdatascience","https://open.spotify.com/show/0x4laIZ3OSlnAlr0R7gXsr","https://music.amazon.com/podcasts/f245918a-83ab-4b40-9730-d6e5446ad66e/let's-data-science-%E2%80%94-ai-news-daily"],"founder":{"@type":"Person","name":"Fanindra Kumar","jobTitle":"Founder","worksFor":{"@type":"Organization","name":"AIDriven Technologies Pvt. Ltd."}},"parentOrganization":{"@type":"Organization","name":"AIDriven Technologies Pvt. Ltd."},"foundingDate":"2024","knowsAbout":["Machine Learning","Data Science","Python Programming","SQL","Deep Learning","Statistics","Artificial Intelligence","Data Engineering"],"about":[{"@type":"Thing","name":"SQL","sameAs":"https://en.wikipedia.org/wiki/SQL"},{"@type":"Thing","name":"Python","sameAs":"https://en.wikipedia.org/wiki/Python_(programming_language)"},{"@type":"Thing","name":"Data Science","sameAs":"https://en.wikipedia.org/wiki/Data_science"},{"@type":"Thing","name":"Machine Learning","sameAs":"https://en.wikipedia.org/wiki/Machine_learning"},{"@type":"Thing","name":"Statistics","sameAs":"https://en.wikipedia.org/wiki/Statistics"},{"@type":"Thing","name":"Probability","sameAs":"https://en.wikipedia.org/wiki/Probability"}],"teaches":["SQL querying and optimization","Python for data analysis","Machine learning fundamentals","Statistics and probability","Data science interview preparation","AI-guided Socratic problem solving for SQL","AI-guided Socratic problem solving for Python"]}0:{"P":null,"b":"jzF2Ec1gYvbeT7EBNeiEv","p":"","c":["","news","samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3"],"i":false,"f":[[["",{"children":["news",{"children":[["slug","samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3","d"],{"children":["__PAGE__",{}]}]}]},"$undefined","$undefined",true],["",["$","$1","c",{"children":[[["$","link","0",{"rel":"stylesheet","href":"/_next/static/css/ace6d38470ae6967.css?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","precedence":"next","crossOrigin":"$undefined","nonce":"$undefined"}],["$","link","1",{"rel":"stylesheet","href":"/_next/static/css/35e95ca1b12a32ae.css?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","precedence":"next","crossOrigin":"$undefined","nonce":"$undefined"}]],["$","html",null,{"lang":"en","data-scroll-behavior":"smooth","suppressHydrationWarning":true,"children":[["$","head",null,{"children":[["$","link",null,{"rel":"preconnect","href":"https://cdn.sanity.io","crossOrigin":"anonymous"}],["$","link",null,{"rel":"preconnect","href":"https://vbrclococxvgoeqefkzf.supabase.co","crossOrigin":"anonymous"}],"$undefined",["$","link",null,{"rel":"preconnect","href":"https://scripts.scriptwrapper.com","crossOrigin":"anonymous"}],["$","link",null,{"rel":"icon","href":"/lds_logo.svg","type":"image/svg+xml"}],["$","link",null,{"rel":"alternate","type":"application/rss+xml","title":"Let's Data Science - AI News Feed","href":"https://letsdatascience.com/feed.xml"}],["$","script",null,{"dangerouslySetInnerHTML":{"__html":"$2"}}],["$","script",null,{"type":"application/ld+json","dangerouslySetInnerHTML":{"__html":"$3"}}],"$L4","$L5","$L6"]}],"$L7"]}]]}],{"children":["news","$L8",{"children":[["slug","samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3","d"],"$L9",{"children":["__PAGE__","$La",{},null,false]},null,false]},["$Lb",[],[]],false]},null,false],"$Lc",false]],"m":"$undefined","G":["$d",[]],"s":false,"S":true}
f:I[68332,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","83126","static/chunks/83126-b58b5198e9df8aa5.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","14357","static/chunks/14357-a0e81aa0b2a5437c.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81029","static/chunks/81029-74d9b38ffea59a85.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81386","static/chunks/81386-8e95ff73e68d61cf.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81356","static/chunks/81356-b93f41dd021a6f25.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","45574","static/chunks/45574-8d1950da7ebb9809.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","17153","static/chunks/17153-e4fd18c3c9d52d1a.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","7177","static/chunks/app/layout-adcb3fb5581d4a09.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"GoogleAnalytics"]
10:I[65350,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","83126","static/chunks/83126-b58b5198e9df8aa5.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","14357","static/chunks/14357-a0e81aa0b2a5437c.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81029","static/chunks/81029-74d9b38ffea59a85.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81386","static/chunks/81386-8e95ff73e68d61cf.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81356","static/chunks/81356-b93f41dd021a6f25.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","45574","static/chunks/45574-8d1950da7ebb9809.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","17153","static/chunks/17153-e4fd18c3c9d52d1a.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","7177","static/chunks/app/layout-adcb3fb5581d4a09.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
11:I[9766,[],""]
12:I[50960,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18039","static/chunks/app/error-85e6773a2f78a436.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
13:I[98924,[],""]
14:I[52619,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],""]
15:I[37025,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","83126","static/chunks/83126-b58b5198e9df8aa5.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","14357","static/chunks/14357-a0e81aa0b2a5437c.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81029","static/chunks/81029-74d9b38ffea59a85.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81386","static/chunks/81386-8e95ff73e68d61cf.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","81356","static/chunks/81356-b93f41dd021a6f25.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","45574","static/chunks/45574-8d1950da7ebb9809.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","17153","static/chunks/17153-e4fd18c3c9d52d1a.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","7177","static/chunks/app/layout-adcb3fb5581d4a09.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"Analytics"]
17:I[24431,[],"OutletBoundary"]
19:I[15278,[],"AsyncMetadataOutlet"]
1b:I[24431,[],"ViewportBoundary"]
1d:I[24431,[],"MetadataBoundary"]
1e:"$Sreact.suspense"
4:["$","script",null,{"type":"application/ld+json","dangerouslySetInnerHTML":{"__html":"{\"@context\":\"https://schema.org\",\"@type\":\"WebSite\",\"name\":\"Let's Data Science\",\"url\":\"https://letsdatascience.com\",\"description\":\"Interactive data science learning platform with 1,625 SQL and Python coding problems, free courses, 496 interview recall cards, and AI-curated news. All code runs in-browser — no installation required.\",\"inLanguage\":\"en\",\"publisher\":{\"@type\":\"Organization\",\"name\":\"Let's Data Science\",\"url\":\"https://letsdatascience.com\"},\"potentialAction\":{\"@type\":\"SearchAction\",\"target\":\"https://letsdatascience.com/blog?q={search_term_string}\",\"query-input\":\"required name=search_term_string\"},\"about\":[{\"@type\":\"Thing\",\"name\":\"Data Science\",\"sameAs\":\"https://en.wikipedia.org/wiki/Data_science\"},{\"@type\":\"Thing\",\"name\":\"SQL\",\"sameAs\":\"https://en.wikipedia.org/wiki/SQL\"},{\"@type\":\"Thing\",\"name\":\"Python\",\"sameAs\":\"https://en.wikipedia.org/wiki/Python_(programming_language)\"}]}"}}]
e:T7b7,{"@context":"https://schema.org","@type":"SoftwareApplication","name":"LDS Mentor","applicationCategory":"EducationalApplication","operatingSystem":"Web","url":"https://letsdatascience.com/problems","description":"LDS Mentor is an AI-powered coding mentor built into every SQL and Python problem on Let's Data Science. It uses a Socratic teaching method — asking guiding questions and giving targeted hints rather than giving away answers — helping learners genuinely understand data science concepts. Available to Pro subscribers on 1,625 premium problems across 15 real-world industry datasets.","featureList":["Socratic AI hints for every SQL and Python coding problem","Turn-aware context — mentor tracks your attempt history and escalates guidance","Error analysis — identifies bugs in your code and explains root causes","Concept clarification on demand without spoiling the solution","Available on 1,625 SQL and Python data science problems","Covers 15 industry domains: adtech, banking, fintech, healthcare, logistics, and more"],"provider":{"@type":"Organization","name":"Let's Data Science","url":"https://letsdatascience.com"},"offers":{"@type":"Offer","price":"0","priceCurrency":"USD","availability":"https://schema.org/InStock","category":"Subscription","description":"Free tier with 250+ problems. Pro subscription unlocks 1,625 problems and LDS Mentor AI.","url":"https://letsdatascience.com/pricing"},"audience":{"@type":"Audience","audienceType":"Data scientists, data analysts, SQL developers, Python programmers, data science job seekers"},"about":[{"@type":"Thing","name":"Artificial Intelligence","sameAs":"https://en.wikipedia.org/wiki/Artificial_intelligence"},{"@type":"Thing","name":"SQL","sameAs":"https://en.wikipedia.org/wiki/SQL"},{"@type":"Thing","name":"Python","sameAs":"https://en.wikipedia.org/wiki/Python_(programming_language)"},{"@type":"Thing","name":"Socratic method","sameAs":"https://en.wikipedia.org/wiki/Socratic_method"}]}5:["$","script",null,{"type":"application/ld+json","dangerouslySetInnerHTML":{"__html":"$e"}}]
6:["$","script",null,{"type":"text/javascript","async":true,"data-noptimize":"1","data-cfasync":"false","src":"https://scripts.scriptwrapper.com/tags/8af18360-1640-460b-92eb-62d37196f9e0.js"}]
7:["$","body",null,{"className":"__variable_f367f3 __variable_fb7d4f __variable_9a8899 __variable_d501d1 __variable_be5b54 __variable_6d24ac __className_f367f3","children":[["$","$Lf",null,{"gaId":"G-B8ZP2M7077"}],["$","$L10",null,{"initialUser":null,"children":["$","$L11",null,{"parallelRouterKey":"children","error":"$12","errorStyles":[],"errorScripts":[],"template":["$","$L13",null,{}],"templateStyles":"$undefined","templateScripts":"$undefined","notFound":[["$","main",null,{"className":"flex-1 flex items-center justify-center px-4","children":["$","div",null,{"className":"text-center max-w-md","children":[["$","p",null,{"className":"text-8xl font-bold text-neutral-200 select-none","children":"404"}],["$","h1",null,{"className":"mt-4 text-2xl font-semibold text-neutral-900","children":"Page not found"}],["$","p",null,{"className":"mt-2 text-neutral-500","children":"The page you're looking for doesn't exist or has been moved."}],["$","div",null,{"className":"mt-8 flex items-center justify-center gap-3","children":[["$","$L14",null,{"href":"/","className":"px-5 py-2.5 rounded-xl bg-neutral-900 text-white text-sm font-medium hover:bg-neutral-800 transition-colors","children":"Go home"}],["$","$L14",null,{"href":"/problems","className":"px-5 py-2.5 rounded-xl border border-neutral-200 text-neutral-700 text-sm font-medium hover:bg-neutral-50 transition-colors","children":"Practice problems"}]]}]]}]}],[]],"forbidden":"$undefined","unauthorized":"$undefined"}]}],["$","$L15",null,{}]]}]
8:["$","$1","c",{"children":[null,["$","$L11",null,{"parallelRouterKey":"children","error":"$undefined","errorStyles":"$undefined","errorScripts":"$undefined","template":["$","$L13",null,{}],"templateStyles":"$undefined","templateScripts":"$undefined","notFound":"$undefined","forbidden":"$undefined","unauthorized":"$undefined"}]]}]
9:["$","$1","c",{"children":[null,["$","$L11",null,{"parallelRouterKey":"children","error":"$undefined","errorStyles":"$undefined","errorScripts":"$undefined","template":["$","$L13",null,{}],"templateStyles":"$undefined","templateScripts":"$undefined","notFound":"$undefined","forbidden":"$undefined","unauthorized":"$undefined"}]]}]
a:["$","$1","c",{"children":["$L16",null,["$","$L17",null,{"children":["$L18",["$","$L19",null,{"promise":"$@1a"}]]}]]}]
b:["$","div","l",{"className":"min-h-screen bg-[#0a0a0a]","children":[["$","div",null,{"className":"h-16 border-b border-white/10 bg-[#0a0a0a]/80 backdrop-blur-md sticky top-0 z-50"}],["$","main",null,{"className":"max-w-7xl mx-auto px-4 sm:px-6 lg:px-8 py-8 space-y-12","children":[["$","section",null,{"className":"relative rounded-2xl overflow-hidden aspect-[21/9] bg-neutral-900 animate-pulse","children":[["$","div",null,{"className":"absolute inset-0 bg-gradient-to-t from-black/60 to-transparent"}],["$","div",null,{"className":"absolute bottom-0 left-0 p-8 w-full space-y-4","children":[["$","div",null,{"className":"h-4 w-32 bg-white/20 rounded"}],["$","div",null,{"className":"h-10 w-3/4 bg-white/20 rounded"}],["$","div",null,{"className":"h-4 w-1/2 bg-white/20 rounded"}]]}]]}],["$","section",null,{"className":"grid grid-cols-1 lg:grid-cols-3 gap-8","children":[["$","div",null,{"className":"lg:col-span-2 space-y-6","children":[["$","div","1",{"className":"flex gap-4 p-4 rounded-xl bg-neutral-900/50 border border-white/5 animate-pulse","children":[["$","div",null,{"className":"w-1/3 aspect-video bg-neutral-800 rounded-lg"}],["$","div",null,{"className":"flex-1 space-y-3 py-2","children":[["$","div",null,{"className":"h-6 w-3/4 bg-neutral-800 rounded"}],["$","div",null,{"className":"h-4 w-full bg-neutral-800 rounded"}],["$","div",null,{"className":"h-4 w-2/3 bg-neutral-800 rounded"}]]}]]}],["$","div","2",{"className":"flex gap-4 p-4 rounded-xl bg-neutral-900/50 border border-white/5 animate-pulse","children":[["$","div",null,{"className":"w-1/3 aspect-video bg-neutral-800 rounded-lg"}],["$","div",null,{"className":"flex-1 space-y-3 py-2","children":[["$","div",null,{"className":"h-6 w-3/4 bg-neutral-800 rounded"}],["$","div",null,{"className":"h-4 w-full bg-neutral-800 rounded"}],["$","div",null,{"className":"h-4 w-2/3 bg-neutral-800 rounded"}]]}]]}],["$","div","3",{"className":"flex gap-4 p-4 rounded-xl bg-neutral-900/50 border border-white/5 animate-pulse","children":[["$","div",null,{"className":"w-1/3 aspect-video bg-neutral-800 rounded-lg"}],["$","div",null,{"className":"flex-1 space-y-3 py-2","children":[["$","div",null,{"className":"h-6 w-3/4 bg-neutral-800 rounded"}],["$","div",null,{"className":"h-4 w-full bg-neutral-800 rounded"}],["$","div",null,{"className":"h-4 w-2/3 bg-neutral-800 rounded"}]]}]]}]]}],["$","div",null,{"className":"space-y-6","children":[["$","div",null,{"className":"h-64 rounded-xl bg-neutral-900/50 border border-white/5 animate-pulse"}],["$","div",null,{"className":"h-64 rounded-xl bg-neutral-900/50 border border-white/5 animate-pulse"}]]}]]}]]}]]}]
c:["$","$1","h",{"children":[null,[["$","$L1b",null,{"children":"$L1c"}],["$","meta",null,{"name":"next-size-adjust","content":""}]],["$","$L1d",null,{"children":["$","div",null,{"hidden":true,"children":["$","$1e",null,{"fallback":null,"children":"$L1f"}]}]}]]}]
1c:[["$","meta","0",{"charSet":"utf-8"}],["$","meta","1",{"name":"viewport","content":"width=device-width, initial-scale=1, maximum-scale=5"}],["$","meta","2",{"name":"theme-color","media":"(prefers-color-scheme: light)","content":"#ffffff"}],["$","meta","3",{"name":"theme-color","media":"(prefers-color-scheme: dark)","content":"#0a0a0a"}]]
18:null
1a:{"metadata":[["$","title","0",{"children":"Samsung and SK hynix Build HBM Packaging Fabs | Let's Data Science"}],["$","meta","1",{"name":"description","content":"**Samsung Electronics** and **SK hynix** will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a combined **392 trillion won (about $252.5 billion)** investment package the South Korean government detailed on July 2, 2026. Per the Ministry of Trade, Industry and Energy, Samsung Group will invest 140 trillion won in Chungcheong, including 56 trillion won by Samsung Electronics for a dedicated HBM fab and packaging facility, while SK hynix will invest 100 trillion won to build a NAND flash and advanced packaging hub in Cheongju, with 20 trillion won of that earmarked for packaging capacity. For practitioners, the buildout targets a persistent bottleneck: HBM packaging capacity, not just wafer output, has constrained how fast AI accelerator supply can scale."}],["$","link","2",{"rel":"author","href":"https://letsdatascience.com"}],["$","meta","3",{"name":"author","content":"Let's Data Science"}],["$","link","4",{"rel":"manifest","href":"/manifest.webmanifest","crossOrigin":"$undefined"}],["$","meta","5",{"name":"keywords","content":"hbm-packaging,semiconductor-investment,south-korea,semiconductors,memory-chips,ai-infrastructure"}],["$","meta","6",{"name":"creator","content":"Let's Data Science"}],["$","meta","7",{"name":"publisher","content":"Let's Data Science"}],["$","meta","8",{"name":"robots","content":"index, follow, max-image-preview:large, max-snippet:-1"}],["$","meta","9",{"name":"googlebot","content":"index, follow, max-video-preview:-1, max-image-preview:large, max-snippet:-1"}],["$","meta","10",{"name":"category","content":"education"}],["$","meta","11",{"name":"rights","content":"Images displayed in news articles are hotlinked from third-party publishers and credited. See https://letsdatascience.com/copyright for the full takedown policy."}],["$","meta","12",{"name":"rights-standard","content":"https://letsdatascience.com/copyright"}],["$","meta","13",{"name":"copyright","content":"© 2026 Let's Data Science. News images remain the property of their respective publishers."}],["$","link","14",{"rel":"canonical","href":"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3"}],["$","meta","15",{"name":"format-detection","content":"telephone=no, address=no, email=no"}],["$","meta","16",{"name":"google-site-verification","content":"bvgzFXkTPJfMTYHfr0vvJhewEB3n4t60T2Su0bZAlqM"}],["$","meta","17",{"name":"yandex-verification","content":"7d81286967b16ea7"}],["$","meta","18",{"property":"og:title","content":"Samsung and SK hynix Build HBM Packaging Fabs"}],["$","meta","19",{"property":"og:description","content":"**Samsung Electronics** and **SK hynix** will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a combined **392 trillion won (about $252.5 billion)** investment package the South Korean government detailed on July 2, 2026. Per the Ministry of Trade, Industry and Energy, Samsung Group will invest 140 trillion won in Chungcheong, including 56 trillion won by Samsung Electronics for a dedicated HBM fab and packaging facility, while SK hynix will invest 100 trillion won to build a NAND flash and advanced packaging hub in Cheongju, with 20 trillion won of that earmarked for packaging capacity. For practitioners, the buildout targets a persistent bottleneck: HBM packaging capacity, not just wafer output, has constrained how fast AI accelerator supply can scale."}],"$L20","$L21","$L22","$L23","$L24","$L25","$L26","$L27","$L28","$L29","$L2a","$L2b","$L2c","$L2d","$L2e","$L2f","$L30","$L31","$L32","$L33","$L34","$L35","$L36","$L37","$L38"],"error":null,"digest":"$undefined"}
1f:"$1a:metadata"
39:I[80622,[],"IconMark"]
20:["$","meta","20",{"property":"og:url","content":"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3"}]
21:["$","meta","21",{"property":"og:site_name","content":"Let's Data Science"}]
22:["$","meta","22",{"property":"og:locale","content":"en_US"}]
23:["$","meta","23",{"property":"og:image","content":"https://newsimg.koreatimes.co.kr/2026/07/02/502dc788-4636-4aab-becb-1dd816f59fde.png"}]
24:["$","meta","24",{"property":"og:image:width","content":"1200"}]
25:["$","meta","25",{"property":"og:image:height","content":"630"}]
26:["$","meta","26",{"property":"og:image:alt","content":"Samsung and SK hynix Build HBM Packaging Fabs"}]
27:["$","meta","27",{"property":"og:type","content":"article"}]
28:["$","meta","28",{"property":"article:published_time","content":"2026-07-02T01:52:03+00:00"}]
29:["$","meta","29",{"property":"article:modified_time","content":"2026-07-02T01:52:03+00:00"}]
2a:["$","meta","30",{"property":"article:section","content":"Infrastructure"}]
2b:["$","meta","31",{"property":"article:tag","content":"hbm-packaging"}]
2c:["$","meta","32",{"property":"article:tag","content":"semiconductor-investment"}]
2d:["$","meta","33",{"property":"article:tag","content":"south-korea"}]
2e:["$","meta","34",{"property":"article:tag","content":"semiconductors"}]
2f:["$","meta","35",{"property":"article:tag","content":"memory-chips"}]
30:["$","meta","36",{"property":"article:tag","content":"ai-infrastructure"}]
31:["$","meta","37",{"name":"twitter:card","content":"summary_large_image"}]
32:["$","meta","38",{"name":"twitter:creator","content":"@letsdatascience"}]
33:["$","meta","39",{"name":"twitter:title","content":"Samsung and SK hynix Build HBM Packaging Fabs"}]
34:["$","meta","40",{"name":"twitter:description","content":"**Samsung Electronics** and **SK hynix** will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a combined **392 trillion won (about $252.5 billion)** investment package the South Korean government detailed on July 2, 2026. Per the Ministry of Trade, Industry and Energy, Samsung Group will invest 140 trillion won in Chungcheong, including 56 trillion won by Samsung Electronics for a dedicated HBM fab and packaging facility, while SK hynix will invest 100 trillion won to build a NAND flash and advanced packaging hub in Cheongju, with 20 trillion won of that earmarked for packaging capacity. For practitioners, the buildout targets a persistent bottleneck: HBM packaging capacity, not just wafer output, has constrained how fast AI accelerator supply can scale."}]
35:["$","meta","41",{"name":"twitter:image","content":"https://newsimg.koreatimes.co.kr/2026/07/02/502dc788-4636-4aab-becb-1dd816f59fde.png"}]
36:["$","link","42",{"rel":"icon","href":"/icon.png?468085a3f230b950","type":"image/png","sizes":"1024x1024"}]
37:["$","link","43",{"rel":"apple-touch-icon","href":"/apple-icon.png?468085a3f230b950","type":"image/png","sizes":"1024x1024"}]
38:["$","$L39","44",{}]
3a:Te4d,{"@context":"https://schema.org","@type":"NewsArticle","headline":"Samsung and SK hynix Build HBM Packaging Fabs","description":"**Samsung Electronics** and **SK hynix** will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a combined **392 trillion won (about $252.5 billion)** investment package the South Korean government detailed on July 2, 2026. Per the Ministry of Trade, Industry and Energy, Samsung Group will invest 140 trillion won in Chungcheong, including 56 trillion won by Samsung Electronics for a dedicated HBM fab and packaging facility, while SK hynix will invest 100 trillion won to build a NAND flash and advanced packaging hub in Cheongju, with 20 trillion won of that earmarked for packaging capacity. For practitioners, the buildout targets a persistent bottleneck: HBM packaging capacity, not just wafer output, has constrained how fast AI accelerator supply can scale.","url":"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3","image":["https://newsimg.koreatimes.co.kr/2026/07/02/502dc788-4636-4aab-becb-1dd816f59fde.png"],"thumbnailUrl":"https://newsimg.koreatimes.co.kr/2026/07/02/502dc788-4636-4aab-becb-1dd816f59fde.png","datePublished":"2026-07-02T01:52:03.000Z","dateModified":"2026-07-02T01:52:03.000Z","author":{"@type":"Organization","@id":"https://letsdatascience.com#organization","name":"Let's Data Science","url":"https://letsdatascience.com","logo":{"@type":"ImageObject","url":"https://letsdatascience.com/lds_logo.webp","width":1024,"height":1024}},"publisher":{"@type":["Organization","NewsMediaOrganization"],"@id":"https://letsdatascience.com#organization","name":"Let's Data Science","url":"https://letsdatascience.com","logo":{"@type":"ImageObject","url":"https://letsdatascience.com/lds_logo.webp","width":1024,"height":1024},"publishingPrinciples":"https://letsdatascience.com/editorial-standards","sameAs":["https://www.youtube.com/@letsdatascience","https://twitter.com/letsdatascience","https://linkedin.com/company/letsdatascience","https://github.com/letsdatascience"]},"mainEntityOfPage":{"@type":"WebPage","@id":"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3"},"articleSection":"Infrastructure","keywords":"hbm-packaging, semiconductor-investment, south-korea, semiconductors, memory-chips, ai-infrastructure","about":[{"@type":"Thing","name":"hbm packaging"},{"@type":"Thing","name":"semiconductor investment"},{"@type":"Thing","name":"south korea"},{"@type":"Thing","name":"semiconductors"},{"@type":"Thing","name":"memory chips"},{"@type":"Thing","name":"ai infrastructure"}],"citation":[{"@type":"CreativeWork","name":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of W392tr in total investment","url":"https://www.koreaherald.com/article/10795719","publisher":{"@type":"Organization","name":"koreaherald.com"}},{"@type":"CreativeWork","name":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of $252.5 bil. in total investment","url":"https://www.koreatimes.co.kr/business/companies/20260702/samsung-sk-hynix-to-build-hbm-packaging-fabs-in-chungcheong-region-as-part-of-2525-bil-in-total-investment","publisher":{"@type":"Organization","name":"koreatimes.co.kr"}},{"@type":"CreativeWork","name":"South Korea says Samsung and SK Hynix investing in AI, semiconductor mega-projects","url":"https://www.cnbc.com/2026/06/29/samsung-sk-hynix-reported-1point3-reported-trillion-spending-plans.html","publisher":{"@type":"Organization","name":"cnbc.com"}}],"wordCount":651,"isAccessibleForFree":true,"inLanguage":"en"}16:[["$","script",null,{"type":"application/ld+json","dangerouslySetInnerHTML":{"__html":"$3a"}}],"$L3b","$L3c","$L3d","$L3e"]
3f:I[26424,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
40:I[87440,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
3b:["$","script",null,{"type":"application/ld+json","dangerouslySetInnerHTML":{"__html":"{\"@context\":\"https://schema.org\",\"@type\":\"BreadcrumbList\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https://letsdatascience.com\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"News\",\"item\":\"https://letsdatascience.com/news\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Samsung and SK hynix Build HBM Packaging Fabs\",\"item\":\"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3\"}]}"}}]
3c:["$","script",null,{"type":"application/ld+json","dangerouslySetInnerHTML":{"__html":"{\"@context\":\"https://schema.org\",\"@type\":\"WebPage\",\"url\":\"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3\",\"speakable\":{\"@type\":\"SpeakableSpecification\",\"cssSelector\":[\".article-summary\",\".key-points-content\"]}}"}}]
3d:["$","$L3f",null,{"slug":"samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3","title":"Samsung and SK hynix Build HBM Packaging Fabs","type":"news","tags":["hbm-packaging","semiconductor-investment","south-korea","semiconductors","memory-chips","ai-infrastructure"]}]
3e:["$","main",null,{"className":"min-h-screen bg-white","children":[["$","nav",null,{"className":"border-b border-neutral-100 bg-white sticky top-0 z-40","children":["$","div",null,{"className":"max-w-4xl mx-auto px-4 sm:px-6 py-3","children":["$","div",null,{"className":"flex items-center gap-1 text-sm","children":[["$","$L14",null,{"href":"/","className":"flex items-center gap-1.5 px-2.5 py-1.5 rounded-lg text-neutral-500 hover:text-neutral-700 hover:bg-neutral-100/80 transition-all duration-200","children":["$","svg",null,{"className":"w-4 h-4","fill":"none","viewBox":"0 0 24 24","stroke":"currentColor","strokeWidth":1.5,"children":["$","path",null,{"strokeLinecap":"round","strokeLinejoin":"round","d":"M2.25 12l8.954-8.955c.44-.439 1.152-.439 1.591 0L21.75 12M4.5 9.75v10.125c0 .621.504 1.125 1.125 1.125H9.75v-4.875c0-.621.504-1.125 1.125-1.125h2.25c.621 0 1.125.504 1.125 1.125V21h4.125c.621 0 1.125-.504 1.125-1.125V9.75M8.25 21h8.25"}]}]}],["$","svg",null,{"className":"w-4 h-4 text-neutral-300","fill":"none","viewBox":"0 0 24 24","stroke":"currentColor","strokeWidth":2,"children":["$","path",null,{"strokeLinecap":"round","strokeLinejoin":"round","d":"M9 5l7 7-7 7"}]}],["$","$L14",null,{"href":"/news","className":"px-2.5 py-1.5 rounded-lg text-neutral-600 hover:text-neutral-800 hover:bg-neutral-100/80 transition-all duration-200","children":"News"}],["$","svg",null,{"className":"w-4 h-4 text-neutral-300","fill":"none","viewBox":"0 0 24 24","stroke":"currentColor","strokeWidth":2,"children":["$","path",null,{"strokeLinecap":"round","strokeLinejoin":"round","d":"M9 5l7 7-7 7"}]}],["$","span",null,{"className":"px-2.5 py-1.5 rounded-lg text-neutral-900 font-medium bg-neutral-100/60 truncate max-w-[200px] sm:max-w-xs","children":"Samsung and SK hynix Build HBM Packaging Fabs"}]]}]}]}],["$","article",null,{"className":"single-post max-w-4xl mx-auto px-4 sm:px-6 pt-6 pb-8 sm:pt-8 sm:pb-12","children":[["$","header",null,{"className":"mb-8","children":[["$","div",null,{"className":"flex flex-wrap items-center gap-2 mb-4","children":[["$","span",null,{"className":"px-2.5 py-1 text-[10px] font-semibold uppercase tracking-wide bg-neutral-900 text-white rounded","children":"Infrastructure"}],[["$","span","hbm-packaging",{"className":"px-2.5 py-1 rounded text-[11px] font-medium text-neutral-600 bg-neutral-100 hover:bg-neutral-200 transition-colors cursor-default","children":"hbm packaging"}],["$","span","semiconductor-investment",{"className":"px-2.5 py-1 rounded text-[11px] font-medium text-neutral-600 bg-neutral-100 hover:bg-neutral-200 transition-colors cursor-default","children":"semiconductor investment"}],["$","span","south-korea",{"className":"px-2.5 py-1 rounded text-[11px] font-medium text-neutral-600 bg-neutral-100 hover:bg-neutral-200 transition-colors cursor-default","children":"south korea"}],["$","span","semiconductors",{"className":"px-2.5 py-1 rounded text-[11px] font-medium text-neutral-600 bg-neutral-100 hover:bg-neutral-200 transition-colors cursor-default","children":"semiconductors"}]]]}],["$","h1",null,{"className":"font-serif-display text-[2.125rem] sm:text-[2.625rem] lg:text-[3.25rem] font-normal text-neutral-900 leading-[1.08] tracking-[-0.015em] mb-6","children":"Samsung and SK hynix Build HBM Packaging Fabs"}],["$","div",null,{"className":"flex flex-wrap items-center justify-between gap-4 pb-6 border-b border-neutral-100","children":[["$","div",null,{"className":"flex flex-wrap items-center gap-3 text-sm text-neutral-500","children":[["$","$L40",null,{"sources":[{"url":"https://www.koreaherald.com/article/10795719","title":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of W392tr in total investment","domain":"koreaherald.com","snippet":"An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory fabs and packaging facilities.","scraped":true},{"url":"https://www.koreatimes.co.kr/business/companies/20260702/samsung-sk-hynix-to-build-hbm-packaging-fabs-in-chungcheong-region-as-part-of-2525-bil-in-total-investment","title":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of $252.5 bil. in total investment","domain":"koreatimes.co.kr","snippet":"An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including high bandwidth memory (HBM)...","scraped":false},{"url":"https://www.cnbc.com/2026/06/29/samsung-sk-hynix-reported-1point3-reported-trillion-spending-plans.html","title":"South Korea says Samsung and SK Hynix investing in AI, semiconductor mega-projects","domain":"cnbc.com","snippet":"South Korea outlines a wider multi-site investment push by Samsung and SK Hynix tied to AI-era chip and memory production.","scraped":false}]}],"$L41","$L42","$L43"]}],"$L44"]}]]}],"$L45","$L46","$L47"]}],"$L48","$L49"]}]
4a:I[27899,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
4b:I[5705,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
4c:I[36886,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
58:I[42949,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
41:[["$","span",null,{"className":"text-neutral-200","children":"|"}],["$","time",null,{"dateTime":"2026-07-02T01:52:03+00:00","className":"text-neutral-500","children":"July 2, 2026"}]]
42:["$","span",null,{"className":"text-neutral-200","children":"|"}]
43:["$","span",null,{"className":"text-neutral-500","children":["By ",["$","$L14",null,{"href":"/editorial-standards","className":"text-neutral-700 font-medium underline-offset-2 hover:underline hover:text-neutral-900","children":"LDS Team"}]]}]
44:["$","div",null,{"className":"flex items-center gap-2","children":[["$","$L4a",null,{"url":"https://letsdatascience.com/news/samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3","title":"Samsung and SK hynix Build HBM Packaging Fabs","summary":"**Samsung Electronics** and **SK hynix** will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a combined **392 trillion won (about $252.5 billion)** investment package the South Korean government detailed on July 2, 2026. Per the Ministry of Trade, Industry and Energy, Samsung Group will invest 140 trillion won in Chungcheong, including 56 trillion won by Samsung Electronics for a dedicated HBM fab and packaging facility, while SK hynix will invest 100 trillion won to build a NAND flash and advanced packaging hub in Cheongju, with 20 trillion won of that earmarked for packaging capacity. For practitioners, the buildout targets a persistent bottleneck: HBM packaging capacity, not just wafer output, has constrained how fast AI accelerator supply can scale.","compact":true}],["$","div",null,{"className":"flex items-center gap-2","children":[["$","div",null,{"className":"relative group","children":[["$","div",null,{"className":"w-10 h-10 text-sm rounded-full bg-green-600/75 text-white font-bold flex items-center justify-center shadow","aria-label":"Relevance score: 7.4","children":"7.4"}],false]}],["$","span",null,{"className":"text-xs text-neutral-500","children":"Relevance Score"}]]}]]}]
45:["$","$L4b",null,{"imageUrl":"https://newsimg.koreatimes.co.kr/2026/07/02/502dc788-4636-4aab-becb-1dd816f59fde.png","alt":"Samsung and SK hynix Build HBM Packaging Fabs"}]
46:["$","$L4c",null,{"summary":"**Samsung Electronics** and **SK hynix** will build new high-bandwidth memory (HBM) packaging fabs in South Korea's Chungcheong region as part of a combined **392 trillion won (about $252.5 billion)** investment package the South Korean government detailed on July 2, 2026. Per the Ministry of Trade, Industry and Energy, Samsung Group will invest 140 trillion won in Chungcheong, including 56 trillion won by Samsung Electronics for a dedicated HBM fab and packaging facility, while SK hynix will invest 100 trillion won to build a NAND flash and advanced packaging hub in Cheongju, with 20 trillion won of that earmarked for packaging capacity. For practitioners, the buildout targets a persistent bottleneck: HBM packaging capacity, not just wafer output, has constrained how fast AI accelerator supply can scale."}]
4d:T4ef,The Ministry of Trade, Industry and Energy said an industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong region, including HBM fabs and packaging facilities from Samsung Electronics and SK hynix, as a follow-up to President Lee Jae Myung's broader "tripolar" mega-project strategy for AI-led industrial growth (Korea Herald; Korea Times). Samsung Group pledged a total of 140 trillion won for the region: 56 trillion won by Samsung Electronics for an HBM fab and packaging facility, 67 trillion won by Samsung Display for OLED and next-generation display lines, 8 trillion won by Samsung Electro-Mechanics for AI-server package substrates, and 9 trillion won by Samsung SDI for battery manufacturing. Samsung Electronics Chairman Lee Jae-yong said the investment would help the region "grow into a global hub for IT materials and components" (Korea Herald). SK hynix said it will invest 100 trillion won to establish Cheongju as its next-generation NAND flash hub, split between 80 trillion won for the new M17 fab and 20 trillion won for advanced packaging facilities including a P&T7 plant; CEO Kwak Noh-jung said the M17 fab is targeted to break ground next year and begin operations in the first half of 2029.47:["$","div",null,{"className":"mvt-content entry-content","children":[["$","div",null,{"className":"article-summary mb-10","children":["$","div",null,{"className":"text-[20px] text-stone-800 leading-[1.6] font-serif font-normal","children":[["$","div","0",{"className":"mt-6 first:mt-0","children":[["$","p","0",{"className":"","children":["South Korea's newest chip investment package is notable less for its headline size than for what it specifically targets: HBM packaging capacity, the assembly step that has trailed wafer fabrication as a bottleneck on AI accelerator supply. For teams planning multi-year GPU and memory procurement, dedicated packaging buildout is a more direct capacity signal than fab announcements alone."]}]]}],["$","div","1",{"className":"mt-10 first:mt-0","children":[["$","h3",null,{"className":"font-serif-display text-[1.5rem] sm:text-[1.75rem] font-normal text-neutral-900 leading-[1.15] tracking-[-0.01em] mb-4 flex items-center gap-2.5","children":[["$","span",null,{"className":"w-1 h-7 bg-neutral-800 rounded-full flex-shrink-0"}],"What happened"]}],["$","div",null,{"className":"pl-3 border-l-2 border-neutral-100","children":[["$","p","0",{"className":"","children":["$4d"]}]]}]]}],["$","div","2",{"className":"mt-10 first:mt-0","children":[["$","h3",null,{"className":"font-serif-display text-[1.5rem] sm:text-[1.75rem] font-normal text-neutral-900 leading-[1.15] tracking-[-0.01em] mb-4 flex items-center gap-2.5","children":[["$","span",null,{"className":"w-1 h-7 bg-neutral-800 rounded-full flex-shrink-0"}],"Industry context"]}],["$","div",null,{"className":"pl-3 border-l-2 border-neutral-100","children":[["$","p","0",{"className":"","children":["The Chungcheong package sits alongside a separate, larger investment plan the two companies unveiled days earlier for a southwestern Korean chip complex, part of a reported combined commitment in the hundreds of billions of dollars across multiple sites this year as Seoul pushes to cement its position in AI-era memory supply (CNBC). Samsung Group expects the Chungcheong investments alone to create roughly 250,000 jobs, and the government is offering tax incentives, policy financing, and administrative support to accelerate construction."]}]]}]]}],["$","div","3",{"className":"mt-10 first:mt-0","children":["$L4e","$L4f"]}],"$L50"]}]}],"$L51","$L52","$L53","$L54","$L55","$L56","$L57"]}]
59:Te0c,Editorial analysis: Platform-level metadata and disclosure policies are an operational lever that affects discoverability, developer economics, and how practitioners construct provenance and audit trails. Engineers and product teams working on asset pipelines, dataset curation, and model governance should treat platform tagging policies as a behavioral signal that can alter usage patterns and require changes to metadata, logging, and provenance capture.

What happened, as reported: Per gamesindustry.biz (June 26, 2026), Tim Sweeney, CEO of **Epic Games**, said Valve's decision to attach AI disclosure labels to projects on **Steam** is "really irresponsible," and warned the labels can act as a "Scarlet Letter of AI" that harms a game's chance of success. Tom's Hardware (June 25, 2026) and PC Gamer (June 24, 2026) report Sweeney made the comments while discussing the role of AI tools and planned AI integrations in **Unreal Engine 6**. Tom's Hardware additionally reports that titles with Steam's disclosure tag tend to receive significantly fewer reviews and worse public reception, a behavioral pattern Sweeney cited in critique. Tom's Hardware also records Sweeney pointing to **Adobe** as an example of a vendor addressing training-data provenance.

Editorial analysis - technical context: From a practitioner perspective, the debate highlights three technical fault lines. First, provenance: tags at the platform level increase pressure on developers to record and expose training-data and generation provenance for art, audio, and code assets. Second, metrics and feedback loops: discoverability and review-count effects described in reporting mean telemetry and A/B testing for content-safety or labeling changes may be required to measure user reaction. Third, tool integration: adoption of coding assistants and generative asset tools (examples cited in the reporting include code assistants) shifts effort from asset creation to integration and verification, which raises new verification and CI/CD checkpoints.

Industry context: Companies that operate marketplaces commonly use labels to surface moderation, provenance, or regulatory compliance; reporting frames Valve's Steam labels as an instance of that broader trend. Observed patterns in similar platform interventions show metadata controls can discourage certain practices even when they reduce developer burden, because public-facing labels become reputational signals that users and reviewers act on.

What to watch: Reporting does not include a public statement from **Valve** explaining the rationale or data that led to the disclosure policy, so observers should track any Valve commentary or policy updates. Practitioners should watch whether Steam adjusts tag semantics, whether other platforms adopt similar disclosure fields, and whether firms publishing engines or asset tools build provenance export features (for example, the provenance efforts Sweeney referenced at **Adobe**, per Tom's Hardware). Also monitor measurable signals such as changes in review counts, wishlisting, and conversion for titles with and without the tag to assess real-world impact.

Editorial analysis: For teams building ML-enabled game tools, this episode is a reminder that platform-level metadata creates cross-functional requirements: product, legal, and engineering must coordinate on provenance capture, UX for disclosure, and telemetry to quantify downstream effects. These are engineering and data problems - not only PR problems - and they affect how ML practitioners instrument models, datasets, and generated assets.5a:Tae9,For practitioners, government-led regional industrial projects that bundle semiconductors, physical AI, and data-center buildouts change where compute and data concentrate, and therefore shift choices around latency-sensitive workloads, procurement timelines, and long-term vendor relationships.

**What happened:**
President Lee Jae Myung pledged on July 2, 2026, to make the central Chungcheong provinces a global hub for AI-led innovation, speaking at a public briefing in Asan (Yonhap). The remark followed government announcements promoting a so-called "tripolar mega project" focused on attracting large-scale investment in semiconductors, physical AI, and AI data centers (Yonhap). Yonhap reports that companies including Samsung Group and SK hynix unveiled investment pledges cited at 392 trillion won (about $252.5 billion) to construct a high-bandwidth memory fab, a packaging facility, and related sites in Chungcheong. Earlier coverage on June 29 cited an 800 trillion-won (about $519 billion) investment framework by the country's major chipmakers tied to the broader national initiative.

**Technical context:**
Concentrating fabs, packaging, and AI data centers in a single region typically produces a tighter local ecosystem for high-bandwidth, low-latency interconnects and reduces cross-border logistics for large-scale model training and hardware assembly. For ML engineers, that can mean faster access to onshore GPU and accelerator capacity, lower data-egress friction for regulated workloads, and potential opportunities for co-located edge deployments. At the same time, such concentration increases regional dependencies that infrastructure and procurement teams will need to model in disaster-recovery and capacity planning.

**Industry context:**
Large, coordinated public-private investment packages often accelerate supply-chain timelines, but they also require years to move from permitting to production. Observers following comparable projects will watch for concrete signals such as land-allocation decisions, permitting approvals, announced construction timelines, and vendor contracts, since those milestones determine when new compute capacity actually becomes operational. This pledge sits alongside the same Chungcheong package covered separately (Samsung and SK hynix's specific HBM packaging fab commitments), underscoring that the investment figures reported nationally and regionally overlap rather than stack additively.

**What to watch:**
Follow-on announcements of project-level timetables, specific fab and data-center partners, and any subsidies or zoning changes that could affect build speed and operating costs. Also track hiring and local education initiatives, which indicate pipeline development for technicians and ML infrastructure staff.5b:Ta9d,The partnership is a useful data point on how quantum-cloud access is being localized: rather than Korean users routing workloads through IBM, Amazon Braket, or Microsoft Azure Quantum, a domestic data-center operator is now offering a QaaS layer built specifically to satisfy local data-residency rules.

**What happened:**
Classiq, an Israeli quantum-software firm, and QAI Co., Ltd., a Korean quantum-AI data-center specialist led by CEO Seman Im, signed a multiyear commercial agreement to launch what the companies describe as Korea's first locally operated Quantum-as-a-Service offering (The Quantum Insider; Korea Times). Classiq's platform automatically transforms high-level functional models into optimized, hardware-executable quantum programs portable across different quantum backends; QAI will run the QaaS business under its own brand, handling customer acquisition, business development, and service operations, while Classiq supplies the software platform and a technical-support framework tailored to Korean users (The Quantum Insider). Classiq CEO Nir Minerbi said "quantum computing will not flourish through hardware access alone" and framed the offering as making "advanced quantum software and cutting-edge quantum resources seamlessly accessible in Korea." QAI's Im said the goal is to let "major Korean institutions and enterprises more realistically evaluate quantum computing and apply it in practical business settings."

**Industry context:**
The companies say they will also explore local infrastructure options to meet the data-sovereignty and security requirements of Korean public institutions and large enterprises, aiming at a "sovereignty-focused quantum cloud service model." That framing echoes a broader pattern across Asia-Pacific markets, where governments and regulated enterprises increasingly prefer quantum and AI infrastructure that keeps data and compute within national borders rather than depending on foreign cloud quantum services.

**For practitioners:**
For teams evaluating quantum pilots in Korea, a locally hosted QaaS option changes the compliance calculus for regulated data (finance, government, healthcare) that cannot leave the country, and Classiq's hardware-portable compiler layer means algorithms developed on the service are not locked to a single backend. It is still early: no customer names, pricing, or specific hardware partners have been disclosed publicly.

**What to watch:**
Which quantum hardware providers QAI's infrastructure will support at launch, whether the service publishes concrete customer wins or benchmarks, and whether other Korean data-center operators pursue similar sovereignty-focused quantum-cloud partnerships in response.48:["$","$L58",null,{"items":[{"event_id":"41fb8269-fe4b-4d08-b466-ccd72cfcbaf8","slug":"tim-sweeney-criticizes-valves-steam-ai-labels-41fb8269","canonical_title_ai":"Tim Sweeney Criticizes Valve's Steam AI Labels","summary_short":"Platform-level disclosure requirements shape developer incentives, discovery mechanics, and provenance practices, relevant for ML engineers and toolmakers building asset pipelines or model-audit tooling. Reported facts: Tim Sweeney, CEO of **Epic Games**, called Valve's decision to add AI disclosure labels on **Steam** \"really irresponsible,\" according to gamesindustry.biz (June 26, 2026). Reporting by Tom's Hardware and PC Gamer notes Sweeney made the remarks while discussing AI integrations planned for **Unreal Engine 6**. Tom's Hardware reports that titles flagged with the disclosure receive significantly fewer reviews and are often viewed less favorably, a dynamic Sweeney described as a \"Scarlet Letter of AI,\" per gamesindustry.biz. Sweeney also argued that AI tools increase productivity for routine tasks and pointed to companies such as Adobe addressing provenance, as reported by Tom's Hardware.","summary_full":"$59","key_points":["Platform disclosure tags alter developer incentives and user behavior; engineers should instrument telemetry to measure discoverability impact.","Public-facing provenance signals increase demand for robust dataset and asset provenance tracking across build pipelines.","Marketplace labeling tends to create reputational feedback loops; measuring A/B effects on reviews and conversions is essential."],"tags":["game-development","platform-policy","epic-games","valve","ai-disclosure"],"content_type":"Policy & Regulation","impact_score":6.8,"scoring_rationale":"This story matters to practitioners because platform disclosure labels directly affect discoverability, reputational risk, and the technical burden of provenance capture for ML-enabled content. It is notable but not frontier-shifting.","first_published_at":"2026-07-02T02:58:49+00:00","last_published_at":"2026-07-02T02:58:49+00:00","image_url":null,"primary_domain":"techdirt.com","source_count":1,"sources":[{"url":"http://www.techdirt.com/2026/07/01/no-tim-sweeney-valve-isnt-irresponsible-for-having-an-ai-disclosure-tag-on-games/","title":"No, Tim Sweeney, Valve Isn’t ‘Irresponsible’ For Having An AI Disclosure Tag On Games","domain":"techdirt.com","image_url":"http://www.techdirt.com/wp-content/themes/techdirt/assets/images/td-rect-logo-white.png","is_primary":true,"published_at":"2026-07-02T02:58:49+00:00"}],"sources_json":[{"url":"https://www.gamesindustry.biz/epics-sweeney-claims-steam-ai-labels-are-really-irresponsible-of-valve","date":"6 days ago","rank":1,"title":"Epic's Sweeney claims Steam AI labels are \"really irresponsible of ...","domain":"gamesindustry.biz","scraped":true,"snippet":"Sweeney has been outspoken about the use of AI in the games industry, previously arguing that platforms should stop tagging games that make use ...","imageUrl":""},{"url":"https://www.tomshardware.com/tech-industry/artificial-intelligence/epic-boss-tim-sweeney-blasts-steam-for-putting-ai-tags-on-games-says-move-is-irresponsible-of-valve","date":"6 days ago","rank":2,"title":"Epic boss Tim Sweeney blasts Steam for putting AI tags on games","domain":"tomshardware.com","scraped":true,"snippet":"Sweeney argues that AI is just a tool for productivity that could help game developers create unique content. The AI disclosure warning on Steam ...","imageUrl":""},{"url":"https://www.pcgamer.com/gaming-industry/tim-sweeney-on-the-future-of-games-ai-and-whether-valve-will-ever-join-forces-with-epic-its-now-clear-that-nobodys-going-to-end-up-with-an-absolute-monopoly/","date":"8 days ago","rank":3,"title":"Tim Sweeney on the future of games, AI, and whether Valve will ever ...","domain":"pcgamer.com","scraped":true,"snippet":"The Epic Games CEO discusses his vision for \"Team Open,\" his objections to Steam's AI disclosure requirement, and the huge problems facing ...","imageUrl":""}]},{"event_id":"649a141b-8e46-44d6-9ff0-fbd25ce59321","slug":"korea-trims-bureaucracy-to-attract-elite-tech-experts-649a141b","canonical_title_ai":"Korea trims bureaucracy to attract elite tech experts","summary_short":"Global competition for advanced-technology talent affects hiring and collaboration dynamics across labs and companies. **Korea** is trimming bureaucracy to woo elite foreign engineers and researchers, rolling out the red carpet for advanced-technology personnel from abroad.","summary_full":null,"key_points":["What: Korea is reducing bureaucratic barriers and 'rolling out the red carpet' for elite foreign engineers and researchers.","Why: An increasingly competitive global scramble for advanced technology is driving countries to compete for top technical talent.","So what: For practitioners: this could expand cross-border hiring options and collaboration opportunities with Korean institutions."],"tags":["talent-policy","immigration","asia-korea"],"content_type":"Policy & Regulation","impact_score":6.3,"scoring_rationale":"A national policy easing to attract elite foreign tech talent materially affects talent mobility and research ecosystems, making it a notable development for AI and tech practitioners tracking global competition.","first_published_at":"2026-07-02T02:52:03+00:00","last_published_at":"2026-07-02T02:52:03+00:00","image_url":"https://newsimg.koreatimes.co.kr/2026/07/02/9ed8eae1-7987-45e8-b7a8-d5a897f95d34.jpg","primary_domain":"koreatimes.co.kr","source_count":1,"sources":[{"url":"https://www.koreatimes.co.kr/southkorea/20260702/korea-trims-bureaucracy-to-woo-elite-global-tech-experts","title":"Korea trims bureaucracy to woo elite global tech experts","domain":"koreatimes.co.kr","image_url":"https://newsimg.koreatimes.co.kr/2026/07/02/9ed8eae1-7987-45e8-b7a8-d5a897f95d34.jpg","is_primary":true,"published_at":"2026-07-02T02:52:03+00:00"}],"sources_json":[{"url":"https://www.koreatimes.co.kr/southkorea/law-crime/20260608/korea-marks-1-year-of-visa-immigration-policy-reforms","date":"Jun 8, 2026","rank":1,"title":"Korea marks 1 year of visa, immigration policy reforms","domain":"koreatimes.co.kr","scraped":false,"snippet":"To anchor top-tier tech talent, Korea has dramatically lowered its historically rigid immigration barriers. The government expanded its “Top- ...","imageUrl":""}]},{"event_id":"7d9a15c5-58b5-4774-bc92-c36f8469280e","slug":"lee-vows-to-make-chungcheong-an-ai-innovation-hub-7d9a15c5","canonical_title_ai":"Lee vows to make Chungcheong an AI innovation hub","summary_short":"South Korean President **Lee Jae Myung** pledged on July 2, 2026, to turn the central **Chungcheong** provinces into a global hub for AI-led innovation, telling a public briefing in Asan the region \"possesses infinite growth potential,\" according to Yonhap. The pledge follows the government's \"tripolar mega project\" strategy and accompanies corporate investment pledges Yonhap attributes to companies including Samsung Group and SK hynix, cited at **392 trillion won (about $252.5 billion)**, to build a high-bandwidth memory fab, packaging facilities, and related sites in Chungcheong. Earlier Yonhap coverage from June 29 described a broader 800 trillion-won (about $519 billion) investment framework tied to semiconductors, physical AI, and AI data centers nationally. For practitioners, government-led regional bundling of fabs, packaging, and AI data centers concentrates compute and data gravity, shifting decisions about latency-sensitive workloads and long-term vendor relationships.","summary_full":"$5a","key_points":["President Lee Jae Myung pledged to make Chungcheong a global AI innovation hub, tied to a national tripolar mega project investment strategy.","Reported corporate pledges totaling hundreds of trillions of won accelerate infrastructure plans but require multi-year execution before capacity is available.","Practitioners should monitor permitting, construction timetables, and vendor contracts as the earliest signals that onshore compute capacity will become operational."],"tags":["south-korea","chungcheong","semiconductors","ai-infrastructure","samsung","sk-hynix"],"content_type":"Infrastructure","impact_score":6.5,"scoring_rationale":"National-scale government investment pledges and a coordinated regional strategy materially affect chip and AI data-center supply planning, notable for infrastructure practitioners but a policy pledge rather than an immediate operational change, and it overlaps substantially with the separately-reported Samsung/SK hynix Chungcheong package.","first_published_at":"2026-07-02T02:37:20+00:00","last_published_at":"2026-07-02T02:37:20+00:00","image_url":"https://img7.yna.co.kr/photo/yna/YH/2026/07/02/PYH2026070206130001300_P4.jpg","primary_domain":"en.yna.co.kr","source_count":1,"sources":[{"url":"https://en.yna.co.kr/view/AEN20260702004500315","title":"Lee vows to turn Chungcheong region into center of AI-led innovation","domain":"en.yna.co.kr","image_url":"https://img7.yna.co.kr/photo/yna/YH/2026/07/02/PYH2026070206130001300_P4.jpg","is_primary":true,"published_at":"2026-07-02T02:37:20+00:00"}],"sources_json":[{"url":"https://en.yna.co.kr/view/AEN20260702004500315","date":"2026-07-02","rank":1,"title":"Lee vows to turn Chungcheong region into center of AI-led innovation","domain":"en.yna.co.kr","scraped":true,"snippet":"SEOUL, July 2 (Yonhap) -- President Lee Jae Myung vowed Thursday to turn the central Chungcheong region into a global hub of AI-led innovation.","imageUrl":""},{"url":"https://en.yna.co.kr/view/AEN20260629006153315","date":"2026-06-29","rank":2,"title":"Lee vows to secure chip, AI supremacy through large-scale investment","domain":"en.yna.co.kr","scraped":true,"snippet":"SEOUL, June 29 (Yonhap) -- President Lee outlines an 800 trillion-won investment framework tied to semiconductors, physical AI and AI data centers.","imageUrl":""},{"url":"https://www.koreaherald.com/article/10795719","date":"2026-07-02","rank":3,"title":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of W392tr in total investment","domain":"koreaherald.com","scraped":true,"snippet":"An industrywide 392 trillion-won ($252.5 billion) investment will be injected into the central Chungcheong area, including HBM fabs and packaging facilities.","imageUrl":""}]},{"event_id":"11f1ed85-6863-4157-8c57-6c08ba0058e0","slug":"classiq-and-qai-launch-koreas-first-quantum-cloud-11f1ed85","canonical_title_ai":"Classiq and QAI Launch Korea's First Quantum Cloud","summary_short":"**Classiq Technologies** and Korean data-center operator **QAI Co., Ltd.** signed a commercial agreement to launch South Korea's first locally operated Quantum-as-a-Service (QaaS) offering, the companies announced July 1, 2026. The joint platform combines Classiq's SOC 2-accredited quantum software, which compiles high-level functional models into hardware-executable quantum programs portable across multiple quantum computing backends, with QAI's domestic AI data-center infrastructure, letting Korean enterprises, public institutions, and researchers develop and run quantum applications while keeping data in-country. QAI will operate and brand the service, handling customer acquisition and operations, while Classiq provides the software platform and technical support. For practitioners, the deal shows quantum-software vendors partnering with local infrastructure operators specifically to meet data-sovereignty requirements rather than relying solely on foreign hyperscaler quantum-cloud offerings.","summary_full":"$5b","key_points":["Classiq and QAI launched Korea's first locally operated Quantum-as-a-Service platform, combining Classiq's software with QAI's domestic data-center infrastructure.","The offering is explicitly framed around data sovereignty, letting regulated Korean institutions run quantum workloads without routing data through foreign cloud providers.","Classiq's compiler layer makes quantum programs portable across hardware backends, though no specific hardware partners or customers have been named yet."],"tags":["quantum-computing","quantum-cloud","korea","south-korea","sovereign-ai"],"content_type":"Infrastructure","impact_score":5.4,"scoring_rationale":"A regional quantum-infrastructure milestone with a clear data-sovereignty angle and named executive quotes from both companies, corroborated across three independent outlets, but it is an early-stage commercial launch with no disclosed customers or hardware partners yet, keeping it in the solid-but-not-major tier.","first_published_at":"2026-07-02T02:27:03+00:00","last_published_at":"2026-07-02T02:27:03+00:00","image_url":"https://newsimg.koreatimes.co.kr/2026/07/02/36fde32a-761c-44ce-bb19-536f596d4ea4.jpeg","primary_domain":"koreatimes.co.kr","source_count":1,"sources":[{"url":"https://www.koreatimes.co.kr/business/companies/20260702/classiq-qai-sign-partnership-to-launch-koreas-1st-quantum-cloud-service","title":"Classiq, QAI sign partnership to launch Korea's 1st quantum cloud service","domain":"koreatimes.co.kr","image_url":"https://newsimg.koreatimes.co.kr/2026/07/02/36fde32a-761c-44ce-bb19-536f596d4ea4.jpeg","is_primary":true,"published_at":"2026-07-02T02:27:03+00:00"}],"sources_json":[{"url":"https://thequantuminsider.com/2026/07/01/classiq-and-qai-launch-quantum-cloud-offering-in-korea/","date":"2026-07-01","rank":1,"title":"Classiq and QAI Launch Quantum Cloud Offering in Korea","domain":"thequantuminsider.com","scraped":true,"snippet":"Classiq and QAI have signed a commercial agreement to launch South Korea's first locally operated Quantum-as-a-Service (QaaS) offering.","imageUrl":""},{"url":"https://www.koreatimes.co.kr/business/companies/20260702/classiq-qai-sign-partnership-to-launch-koreas-1st-quantum-cloud-service","date":"2026-07-02T02:27:03+00:00","rank":2,"title":"Classiq, QAI sign partnership to launch Korea's 1st quantum cloud service","domain":"koreatimes.co.kr","scraped":false,"snippet":"Classiq Technologies, an Israeli quantum software firm, and Korean data center operator QAI have signed a multiyear agreement to launch the country's first local quantum cloud service.","imageUrl":""},{"url":"https://quantumzeitgeist.com/quantum-cloud-offering-classiq-qai/","date":"2026-07-01","rank":3,"title":"Classiq & QAI Launch Korea's First Local Quantum Cloud Offering","domain":"quantumzeitgeist.com","scraped":false,"snippet":"A multi-year partnership between Classiq and QAI Co., Ltd. establishes Korea's first local Quantum-as-a-Service offering.","imageUrl":""}]}]}]
49:["$","div",null,{"className":"max-w-4xl mx-auto px-4 sm:px-6 py-8 border-t border-neutral-200","children":[["$","$L14",null,{"href":"/news","className":"inline-flex items-center gap-2 text-sm font-medium text-neutral-600 hover:text-neutral-900 transition-colors","children":[["$","svg",null,{"className":"w-4 h-4","fill":"none","viewBox":"0 0 24 24","stroke":"currentColor","strokeWidth":2,"children":["$","path",null,{"strokeLinecap":"round","strokeLinejoin":"round","d":"M10 19l-7-7m0 0l7-7m-7 7h18"}]}],"Back to News Feed"]}],["$","p",null,{"className":"mt-6 text-xs text-neutral-400 leading-relaxed max-w-2xl","children":["News on Let's Data Science is compiled from multiple public sources with editorial oversight. See our"," ",["$","$L14",null,{"href":"/editorial-standards","className":"underline underline-offset-2 hover:text-neutral-600","children":"Editorial Standards"}]," ","and"," ",["$","$L14",null,{"href":"/corrections","className":"underline underline-offset-2 hover:text-neutral-600","children":"Corrections Policy"}],"."]}]]}]
5c:I[47930,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
5f:I[92726,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
60:I[95582,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
61:I[84980,["52619","static/chunks/52619-c48a18d6f62d2371.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","18720","static/chunks/18720-556e3d1a85c19a06.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","32699","static/chunks/32699-7bc23d08328b1d69.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv","56120","static/chunks/app/news/%5Bslug%5D/page-a69034a0e8113395.js?dpl=dpl_ZYEyTJvDEsFvjPnnUQppeaawjdhv"],"default"]
4e:["$","h3",null,{"className":"font-serif-display text-[1.5rem] sm:text-[1.75rem] font-normal text-neutral-900 leading-[1.15] tracking-[-0.01em] mb-4 flex items-center gap-2.5","children":[["$","span",null,{"className":"w-1 h-7 bg-neutral-800 rounded-full flex-shrink-0"}],"For practitioners"]}]
4f:["$","div",null,{"className":"pl-3 border-l-2 border-neutral-100","children":[["$","p","0",{"className":"","children":["HBM packaging, not wafer output, has repeatedly been cited as the tighter constraint on how fast Nvidia- and AMD-class AI accelerators can ship, since each GPU package requires memory stacks bonded through advanced packaging lines with limited global capacity. New dedicated packaging fabs at Samsung's Onyang and Cheonan hubs and SK hynix's Cheongju site, if delivered on the stated timelines, would add meaningful throughput starting toward the end of this decade rather than in the near term."]}]]}]
50:["$","div","4",{"className":"mt-10 first:mt-0","children":[["$","h3",null,{"className":"font-serif-display text-[1.5rem] sm:text-[1.75rem] font-normal text-neutral-900 leading-[1.15] tracking-[-0.01em] mb-4 flex items-center gap-2.5","children":[["$","span",null,{"className":"w-1 h-7 bg-neutral-800 rounded-full flex-shrink-0"}],"What to watch"]}],["$","div",null,{"className":"pl-3 border-l-2 border-neutral-100","children":[["$","p","0",{"className":"","children":["Construction timelines and yield ramp for the new packaging lines, whether the M17 fab's 2029 target holds, and whether South Korea's broader chip investment wave (this package plus the separate southwestern complex) becomes a template other governments use to court memory and packaging capacity domestically."]}]]}]]}]
51:["$","section",null,{"className":"key-points-content mb-10 p-5 sm:p-6 bg-neutral-50/80 rounded-2xl border border-neutral-100","children":[["$","h2",null,{"className":"text-base font-semibold text-neutral-900 mb-4 flex items-center gap-2","children":[["$","svg",null,{"className":"w-4 h-4 text-neutral-500","fill":"none","viewBox":"0 0 24 24","stroke":"currentColor","strokeWidth":2,"children":["$","path",null,{"strokeLinecap":"round","strokeLinejoin":"round","d":"M9 5H7a2 2 0 00-2 2v12a2 2 0 002 2h10a2 2 0 002-2V7a2 2 0 00-2-2h-2M9 5a2 2 0 002 2h2a2 2 0 002-2M9 5a2 2 0 012-2h2a2 2 0 012 2m-6 9l2 2 4-4"}]}],"Key Points"]}],["$","ul",null,{"className":"space-y-3","children":[["$","li","0",{"className":"flex items-start gap-3","children":[["$","span",null,{"className":"flex-shrink-0 w-5 h-5 rounded-full bg-neutral-200 text-neutral-600 text-[11px] font-bold flex items-center justify-center mt-0.5","children":1}],["$","span",null,{"className":"text-stone-700 leading-[1.6] text-[15px] font-serif","children":["Samsung will invest 140 trillion won and SK hynix 100 trillion won in new Chungcheong-region fabs, including dedicated HBM and advanced packaging capacity."]}]]}],["$","li","1",{"className":"flex items-start gap-3","children":[["$","span",null,{"className":"flex-shrink-0 w-5 h-5 rounded-full bg-neutral-200 text-neutral-600 text-[11px] font-bold flex items-center justify-center mt-0.5","children":2}],["$","span",null,{"className":"text-stone-700 leading-[1.6] text-[15px] font-serif","children":["The plan follows President Lee Jae Myung's broader tripolar mega-project strategy for South Korea's AI-era industrial growth."]}]]}],["$","li","2",{"className":"flex items-start gap-3","children":[["$","span",null,{"className":"flex-shrink-0 w-5 h-5 rounded-full bg-neutral-200 text-neutral-600 text-[11px] font-bold flex items-center justify-center mt-0.5","children":3}],["$","span",null,{"className":"text-stone-700 leading-[1.6] text-[15px] font-serif","children":["Expanded HBM packaging capacity targets a known bottleneck that has constrained how quickly AI accelerator supply can scale industry-wide."]}]]}]]}]]}]
52:["$","section",null,{"className":"mb-10 p-5 bg-neutral-50 rounded-xl border border-neutral-200","children":["$","div",null,{"className":"flex items-start gap-3","children":[["$","div",null,{"className":"flex-shrink-0 w-8 h-8 rounded-lg bg-neutral-900 flex items-center justify-center","children":["$","svg",null,{"className":"w-4 h-4 text-white","fill":"none","viewBox":"0 0 24 24","stroke":"currentColor","strokeWidth":2,"children":["$","path",null,{"strokeLinecap":"round","strokeLinejoin":"round","d":"M9.663 17h4.673M12 3v1m6.364 1.636l-.707.707M21 12h-1M4 12H3m3.343-5.657l-.707-.707m2.828 9.9a5 5 0 117.072 0l-.548.547A3.374 3.374 0 0014 18.469V19a2 2 0 11-4 0v-.531c0-.895-.356-1.754-.988-2.386l-.548-.547z"}]}]}],["$","div",null,{"className":"flex-1 min-w-0","children":[["$","h2",null,{"className":"text-sm font-semibold text-neutral-900 mb-1","children":"Scoring Rationale"}],["$","p",null,{"className":"text-stone-700 leading-[1.6] text-sm font-serif","children":["A large, government-backed, industrywide investment specifically targeting HBM packaging capacity is directly relevant to AI accelerator supply chains, though it is a multi-year build-out rather than an immediate capacity change, keeping it just below the major-story threshold."]}]]}]]}]}]
53:["$","div",null,{"className":"my-8 pt-6 border-t border-neutral-100","children":["$","$L14",null,{"href":"/news/topic/ai-infrastructure","className":"inline-flex items-center gap-2 text-[13px] font-medium text-neutral-600 hover:text-amber-700 transition-colors group","children":[["$","span",null,{"className":"text-[10px] font-bold tracking-[0.18em] uppercase text-amber-700","children":"More"}],["$","span",null,{"className":"font-serif font-medium text-neutral-900 text-[15px]","children":["AI Infrastructure"," news"]}],["$","span",null,{"aria-hidden":"true","className":"transition-transform group-hover:translate-x-0.5","children":"→"}]]}]}]
54:["$","section",null,{"aria-labelledby":"article-sources-heading","className":"mt-12 border-t border-neutral-200 pt-6","children":[["$","div",null,{"className":"flex flex-col gap-1 sm:flex-row sm:items-end sm:justify-between","children":[["$","div",null,{"children":[["$","h2",null,{"id":"article-sources-heading","className":"text-xs font-bold uppercase tracking-[0.18em] text-neutral-500","children":"Sources"}],["$","p",null,{"className":"mt-1 text-sm leading-6 text-neutral-600","children":"Public references used for this report."}]]}],["$","span",null,{"className":"text-xs font-semibold uppercase tracking-[0.16em] text-neutral-400 sm:pb-1","children":[3," source","s"]}]]}],["$","div",null,{"className":"mt-4 overflow-hidden rounded-xl border border-neutral-200 bg-white","children":[["$","div",null,{"className":"divide-y divide-neutral-100","children":[["$","a","https://www.koreaherald.com/article/10795719-0",{"href":"https://www.koreaherald.com/article/10795719","target":"_blank","rel":"noopener noreferrer","className":"group flex min-w-0 items-center gap-3 px-3 py-3 transition-colors hover:bg-neutral-50 sm:px-4","children":[["$","span",null,{"className":"flex h-9 w-9 flex-shrink-0 items-center justify-center rounded-lg border border-neutral-200 bg-white","children":["$","$L5c",null,{"domain":"koreaherald.com","size":22,"className":"h-[22px] w-[22px] rounded-md object-contain"}]}],["$","span",null,{"className":"min-w-0 flex-1","children":[["$","span",null,{"className":"flex min-w-0 items-center gap-2","children":[["$","span",null,{"className":"text-[10px] font-semibold tabular-nums text-neutral-400","children":"01"}],["$","span",null,{"className":"truncate text-[11px] font-bold uppercase tracking-[0.14em] text-neutral-500","children":"koreaherald.com"}]]}],["$","span",null,{"className":"mt-0.5 block truncate text-sm font-medium leading-snug text-neutral-900 group-hover:text-neutral-700","children":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of W392tr in total investment"}]]}],["$","svg",null,{"ref":"$undefined","xmlns":"http://www.w3.org/2000/svg","width":24,"height":24,"viewBox":"0 0 24 24","fill":"none","stroke":"currentColor","strokeWidth":2,"strokeLinecap":"round","strokeLinejoin":"round","className":"lucide lucide-external-link h-3.5 w-3.5 flex-shrink-0 text-neutral-300 transition-colors group-hover:text-neutral-500","aria-hidden":"true","children":[["$","path","1q9fwt",{"d":"M15 3h6v6"}],["$","path","gplh6r",{"d":"M10 14 21 3"}],["$","path","a6xqqp",{"d":"M18 13v6a2 2 0 0 1-2 2H5a2 2 0 0 1-2-2V8a2 2 0 0 1 2-2h6"}],"$undefined"]}]]}],["$","a","https://www.koreatimes.co.kr/business/companies/20260702/samsung-sk-hynix-to-build-hbm-packaging-fabs-in-chungcheong-region-as-part-of-2525-bil-in-total-investment-1",{"href":"https://www.koreatimes.co.kr/business/companies/20260702/samsung-sk-hynix-to-build-hbm-packaging-fabs-in-chungcheong-region-as-part-of-2525-bil-in-total-investment","target":"_blank","rel":"noopener noreferrer","className":"group flex min-w-0 items-center gap-3 px-3 py-3 transition-colors hover:bg-neutral-50 sm:px-4","children":[["$","span",null,{"className":"flex h-9 w-9 flex-shrink-0 items-center justify-center rounded-lg border border-neutral-200 bg-white","children":["$","$L5c",null,{"domain":"koreatimes.co.kr","size":22,"className":"h-[22px] w-[22px] rounded-md object-contain"}]}],["$","span",null,{"className":"min-w-0 flex-1","children":[["$","span",null,{"className":"flex min-w-0 items-center gap-2","children":[["$","span",null,{"className":"text-[10px] font-semibold tabular-nums text-neutral-400","children":"02"}],["$","span",null,{"className":"truncate text-[11px] font-bold uppercase tracking-[0.14em] text-neutral-500","children":"koreatimes.co.kr"}]]}],["$","span",null,{"className":"mt-0.5 block truncate text-sm font-medium leading-snug text-neutral-900 group-hover:text-neutral-700","children":"Samsung, SK hynix to build HBM packaging fabs in Chungcheong region as part of $252.5 bil. in total investment"}]]}],"$L5d"]}],"$L5e"]}],false]}]]}]
55:["$","$L5f",null,{"articleSlug":"samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3"}]
56:["$","$L60",null,{}]
57:["$","$L61",null,{"tags":"$3d:props:tags","articleSlug":"samsung-and-sk-hynix-build-hbm-packaging-fabs-f9069af3"}]
5d:["$","svg",null,{"ref":"$undefined","xmlns":"http://www.w3.org/2000/svg","width":24,"height":24,"viewBox":"0 0 24 24","fill":"none","stroke":"currentColor","strokeWidth":2,"strokeLinecap":"round","strokeLinejoin":"round","className":"lucide lucide-external-link h-3.5 w-3.5 flex-shrink-0 text-neutral-300 transition-colors group-hover:text-neutral-500","aria-hidden":"true","children":[["$","path","1q9fwt",{"d":"M15 3h6v6"}],["$","path","gplh6r",{"d":"M10 14 21 3"}],["$","path","a6xqqp",{"d":"M18 13v6a2 2 0 0 1-2 2H5a2 2 0 0 1-2-2V8a2 2 0 0 1 2-2h6"}],"$undefined"]}]
5e:["$","a","https://www.cnbc.com/2026/06/29/samsung-sk-hynix-reported-1point3-reported-trillion-spending-plans.html-2",{"href":"https://www.cnbc.com/2026/06/29/samsung-sk-hynix-reported-1point3-reported-trillion-spending-plans.html","target":"_blank","rel":"noopener noreferrer","className":"group flex min-w-0 items-center gap-3 px-3 py-3 transition-colors hover:bg-neutral-50 sm:px-4","children":[["$","span",null,{"className":"flex h-9 w-9 flex-shrink-0 items-center justify-center rounded-lg border border-neutral-200 bg-white","children":["$","$L5c",null,{"domain":"cnbc.com","size":22,"className":"h-[22px] w-[22px] rounded-md object-contain"}]}],["$","span",null,{"className":"min-w-0 flex-1","children":[["$","span",null,{"className":"flex min-w-0 items-center gap-2","children":[["$","span",null,{"className":"text-[10px] font-semibold tabular-nums text-neutral-400","children":"03"}],["$","span",null,{"className":"truncate text-[11px] font-bold uppercase tracking-[0.14em] text-neutral-500","children":"cnbc.com"}]]}],["$","span",null,{"className":"mt-0.5 block truncate text-sm font-medium leading-snug text-neutral-900 group-hover:text-neutral-700","children":"South Korea says Samsung and SK Hynix investing in AI, semiconductor mega-projects"}]]}],["$","svg",null,{"ref":"$undefined","xmlns":"http://www.w3.org/2000/svg","width":24,"height":24,"viewBox":"0 0 24 24","fill":"none","stroke":"currentColor","strokeWidth":2,"strokeLinecap":"round","strokeLinejoin":"round","className":"lucide lucide-external-link h-3.5 w-3.5 flex-shrink-0 text-neutral-300 transition-colors group-hover:text-neutral-500","aria-hidden":"true","children":[["$","path","1q9fwt",{"d":"M15 3h6v6"}],["$","path","gplh6r",{"d":"M10 14 21 3"}],["$","path","a6xqqp",{"d":"M18 13v6a2 2 0 0 1-2 2H5a2 2 0 0 1-2-2V8a2 2 0 0 1 2-2h6"}],"$undefined"]}]]}]