Product Launchdirect to chipimmersion coolingocpmodular data center
Refroid and TierX Launch Indigenous Modular Data Centers
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Refroid Technologies and TierX Datacenters announced on March 13, 2026 at the 7th CII Datacenter Blueprint Summit a strategic partnership to launch India’s first indigenous, OCP-aligned modular data center stack integrating Direct-to-Chip and immersion cooling. The factory-built system targets support for processors exceeding 500W per socket and aims for benchmark PUE around 1.2 (Refroid claims 1.05 locally). The stack targets AI, research, and edge deployments.
Scoring Rationale
Strong product-level novelty and deployment relevance, limited by single-source company press release lacking independent validation.
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